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Chip Assembly Die Bonding Process Engineer (m/f/d)

Coherent Corp. · Zurich

Nouveau
Mid 🇬🇧 English
SPC DoE Lean Six Sigma Root cause analysis

Description du poste

About the role

Coherent, a global leader in photonics, is looking for a Chip Assembly Die Bonding Process Engineer to join its semiconductor manufacturing team. The role takes ownership of critical chip assembly processes such as die bonding, curing, marking and inspection, and works closely with R&D, production, quality and suppliers to move new technologies from development into high-volume manufacturing.

Key responsibilities

  • Own and continuously improve chip assembly processes, including die bonding, curing, marking and inspection.
  • Develop, qualify and implement die-bonding processes for new product designs and manufacturing requirements.
  • Define inspection methods, acceptance criteria and equipment qualifications to ensure assembly quality and process control.
  • Analyse process performance, identify root causes of deviations and implement corrective actions to improve yield, quality, throughput and cost.
  • Collaborate with R&D to transfer new technologies and products into manufacturing.
  • Take technical responsibility for die-bonding equipment, including troubleshooting, optimisation and preventive maintenance support.
  • Work with equipment suppliers to evaluate, qualify and introduce new tools and process improvements.
  • Prepare and maintain process documentation, work instructions and training materials, and support cleanroom manufacturing operations.

Required profile

  • Bachelor's or Master's degree in Mechanical, Manufacturing, Electrical or Mechatronics engineering or a related discipline.
  • 1-3 years of hands-on experience in die bonding, semiconductor assembly or a similar precision manufacturing environment.
  • Strong understanding of manufacturing processes, process control and quality improvement methodologies.
  • Experience with process troubleshooting, root cause analysis and data-driven decision making.
  • Excellent English communication skills; German is beneficial but not essential.

Required skills

  • Knowledge of SPC, DoE and other structured process improvement tools.
  • Experience with automated manufacturing equipment and production processes.
  • Advantageous: cleanroom experience, programming, equipment software, soldering processes or Lean Six Sigma.

What we offer

  • Competitive base salary and annual incentive eligibility.
  • Pension or retirement provision, health and wellbeing programmes, life and income protection.
  • Flexible working arrangements where compatible with the role.
  • Learning and professional development, employee recognition and share programmes.

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Coherent Corp.

Zurich