Electro-optical Signal Integrity Internship

About the role

Marvell's team develops silicon photonics-based optical engines and components at the heart of next-generation AI and data center infrastructure, working at the intersection of silicon photonics, advanced packaging and high-speed electronics. This internship is based in Zurich, where the team defines, simulates and tests high-frequency electrical interfaces for optical engines (400G/lane CPO and beyond).

Key responsibilities

• Define, simulate and define the architecture of high-frequency electrical interfaces for next-generation optical engines.
• Perform co-design across photonics, analog/ASIC design and packaging teams to optimize performance, power efficiency and signal integrity.
• Perform testing, characterization and qualification of components and integrated systems.
• Develop and validate end-to-end link budgets, correlating simulation and measurement across electrical and optical domains.
• Analyze measurement data to identify performance limitations and drive design improvements.
• Perform root cause analysis of complex signal integrity issues across electrical and optical domains.

Required profile

• Currently enrolled in a Master's or PhD program in Electrical Engineering, Photonics, Physics or a related field, with an expected graduation date after the internship.
• Solid foundation in RF/microwave engineering, transmission lines and signal integrity fundamentals (S-parameters, impedance matching, loss and crosstalk mechanisms).
• Coursework or research exposure to optical communications, silicon photonics or electro-optical devices (modulators, photodetectors, lasers).
• Experience in EM or circuit simulation (HFSS, CST or ADS) or RF PCB design, or in high-frequency/electro-optical measurements (VNA, oscilloscope, AWG, BERT), preferably in a university lab or prior internship.
• Knowledge of Python or MATLAB for data analysis, instrument automation or system/link simulation.
• Understanding of high-speed link concepts: PAM4 signaling, equalization (FFE, DFE, CTLE) and metrics such as BER, SNR and eye diagrams.
• Exposure to advanced packaging (2.5D/3D integration, co-packaged optics).
• Curiosity, independence, collaborative spirit, clear communication and comfort with ambiguity in a fast-paced environment.