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Principal IC Digital Design Engineer

u-blox · Thalwil

Nouveau
Hybrid Senior 🇬🇧 English
IC design Analog/Mixed-Signal RF Digital design Verification Physical design DFT GNSS

Description du poste

About the role

U-Blox is looking for an experienced Senior Principal IC Design Engineer to lead the development and delivery of integrated circuits for next-generation GNSS applications. The role coordinates chip-level architecture, design, verification, implementation, DFT, production test, characterization and validation so that product, quality, schedule and cost objectives are met. It is based in Thalwil (Switzerland), Athens (Greece), Cork (Ireland) or Leuven (Belgium).

Key responsibilities

  • Own the integrated chip development plan from concept through tape-out and design completion.
  • Align System, RF, Analog/Mixed-Signal, Digital, Verification, Physical Design, DFT, Product, Test, Firmware and Characterization teams on requirements, interfaces, priorities and milestones.
  • Translate GNSS product objectives into a coherent chip execution strategy covering performance, power, area, cost, quality and schedule.
  • Work with Project Managers, Team Leads and Line Managers to build realistic plans, resolve dependencies, mitigate schedule risks and identify resource needs.
  • Provide overall technical direction at chip level while delegating detailed domain leadership to Team Leads and subject-matter experts.
  • Facilitate architectural and implementation trade-offs, and drive an integrated approach to verification, simulation, physical implementation, sign-off and validation.
  • Maintain the chip-level risk registry, communicate program status, risks and recovery plans to engineering leadership and stakeholders.

Required profile

  • Bachelor's, Master's or Ph.D. in Electronic Engineering, Electrical Engineering, Microelectronics or a closely related field.
  • Significant experience in complex IC development, with successful delivery from requirements through tape-out, silicon validation and production release.
  • By preference, proven experience leading a chip or major IC subsystem across multiple disciplines in a semiconductor environment.
  • Ability to influence without direct authority, set accountability and collaborate across cross-functional teams.
  • Strong planning, organization, risk management and communication skills; EU/Schengen citizen or work permit holder.

Required skills

  • Broad understanding of IC architecture: analog/mixed-signal, RF, digital, verification, physical design, DFT, test, packaging and silicon validation.
  • Familiarity with GNSS receiver concepts and low-power, high-performance wireless products.

What we offer

  • A multicultural, international company with over 60 nationalities.
  • Project-based work with colleagues around the world.
  • Hybrid working model, work-from-abroad days and flexible working hours.
  • Regular career discussions and a bonus plan.

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