Additive Manufacturing Internship

About the role

We are looking for a motivated student to join our Additive Manufacturing team at Audi Motorsport in Hinwil, Switzerland. This internship offers hands‑on experience on real F1‑related projects, working side‑by‑side with experienced engineers.

Key responsibilities

• Execute additive‑manufacturing projects, including simulation and compensation of 3D‑printed parts, evaluation of new materials and development of post‑processing surface‑treatment methods.
• Conduct material testing and analysis to monitor processes, investigate failures and identify improvement opportunities.
• Support daily AM department activities by developing machine parameters for metals (primary focus) and plastics.
• Assist in operating additive‑manufacturing machines and the Hot Isostatic Pressing (HIP) system.
• Perform research, data entry and analysis as required.
• Collaborate with team members, attend meetings and contribute to reports or presentations.
• Continuously learn and apply new skills relevant to additive manufacturing.

Required profile

• Currently enrolled in Mechanical Engineering, Materials Science, Process Engineering or a related field.
• Experience or strong interest in additive manufacturing.
• Good communication and teamwork abilities.
• Eagerness to learn, take initiative and lead small projects.
• Basic knowledge of CAD tools such as 3DExperience or CATIA V5/V6 and data‑preparation software like Magics.

Required skills

• Additive Manufacturing processes
• 3D‑printing simulation and compensation
• Material testing and analysis
• Operation of HIP (Hot Isostatic Pressing) equipment
• CAD (3DExperience, CATIA V5/V6)
• Data preparation (Magics)

What we offer

• Practical, hands‑on experience in a professional motorsport environment.
• Mentorship and support from experienced colleagues.
• Exposure to real‑life F1 projects and business challenges.
• Development of key employability skills and networking opportunities.
• Structured onboarding, internal training resources and regular feedback.